data sheet a73b-1/gxg-pf doc. no : qw0905-l rev. : date : 02 - jul. a - 2006 led array ligitek electronics co.,ltd. property of ligitek only la73b-1/gxg-pf lead-free parts pb
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lg2640-1-pf ligitek electronics co.,ltd. property of ligitek only la73b-1/gxg-pf package dimensions part no. 1/5 page 25.0min 3.1 2.9 0.5 typ 2.54typ 1.0min 1.5max 4.3 3.3 + - + - 9.65 0.5 4.65 0.5 2.9x3 5.08 2.5 0.5 typ g 2.54 0.25 4.0 0.5 x g 4.4 15.3 11.6 2.4 0.5 1.5
color note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) green diffused gap la73b-1/gxg-pf green material part no emitted power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current typ. 20 luminous intensity @10ma(mcd) 565302.6 1.712 spectral halfwidth nm peak wave length pnm lensmax. forward voltage @ ma(v) min. 20 min. 50 viewing angle 2 1/2 (deg) 100 -40 ~ +100 -40 ~ +85 ir10 ratings g 120 30 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/5 part no. la73b-1/gxg-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 3/5 part no. la73b-1/gxg-pf
60 seconds max 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. la73b-1/gxg-pf
mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec solder resistance test thermal shock test solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test low temperature storage test high temperature high humidity test high temperature storage test test item reliability test: this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. description reference standard page 5/5 part no. la73b-1/gxg-pf
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